北京AMD招聘后端设计PR ---Mgr / Sr. / MTS Level

王群芳

The following is the JD from AMD Beijing. Pls. feel free to contact me at 18964884773 or wangqunfang1988@msn.cn  TKS~

 

Position Title		Manager of Physical Design
Organization	Beijing R&D Center		Function	Physical Design
Location	Beijing, China		Rep/Add	New

 

 

 

 

 

 

 

 

 

 

DESCRIPTION OF DUTIES IN ADDITION TO THOSE IN JOB DESCRIPTION:
Lead a small team of physical engineers to work with global Front-End design team and physical design team for large scale ASIC chip physical implementation. Focus on physical design of deep sub-micron GPU chips including block level (full chip) floor planning, timing closure, place&route, physical verification etc. The individual is expected to be an expert in at least one PD area and provide technically leadership to the engineering team.

JOB REQUIREMENT:

1.     MSEE with 7+ years or Bachelor with 10+ years of industrial experience in ASIC design

2.     5+ years or more years of experience in physical design of deep submicron digital ASIC chips

3.     Hands on experience in large scale ASIC chip physical design

4.     Knowledgeable in all aspects of deep submicron ASIC design flow

5.     Successfully gone through several complete product development cycles

6.     Demonstrate leadership and work well with cross-functional teams

7.     Good listening, writing and speaking English

8.     Good communication skills, strong interpersonal skills and the flexibility

9.     Dedicated, hard working and good team player

10.  Familiar with Back-End (physical design) EDA tools

11.  Familiar with Front-End EDA tools is a plus

12.  Familiar with Unix/Linux environment and good at scripts

 

Job Title:	Senior/Staff Engineer of Physical Design
City/Town:	Beijing
Country:	China
Job Description:	-          Bachelor with 5+ years of industrial experience or MSEE with 3+ years of industrial experience in ASIC design -          3+ years or more years of experience in physical design of deep submicron digital ASIC chips -          Hands on experience in large scale ASIC chip physical design -          Knowledgeable in all aspects of deep submicron ASIC design flow -          Successfully gone through several complete product development cycles -          Demonstrate leadership and work well with cross-functional teams -          Good listening, writing and speaking English -          Good communication skills, strong interpersonal skills and the flexibility -          Dedicated, hard working and good team player -          Familiar with Back-End (physical design) EDA tools -          Familiar with Front-End EDA tools is a plus -          Familiar with Unix/Linux environment and good at scripts